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ADP124ARHZ-2.7-R7 Fiches technique(PDF) 16 Page - Analog Devices |
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ADP124ARHZ-2.7-R7 Fiches technique(HTML) 16 Page - Analog Devices |
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16 / 20 page ![]() ADP124/ADP125 Rev. 0 | Page 16 of 20 0 20 40 60 80 100 120 140 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 VIN – VOUT (V) TJ MAX ILOAD = 500mA ILOAD = 400mA ILOAD = 300mA ILOAD = 200mA ILOAD = 100mA ILOAD = 10mA ILOAD = 1mA Figure 40. Junction Temperature vs. Power Dissipation, 40 mm2 of PCB Copper at Board Temperature = 85°C PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS Heat dissipation from the package can be improved by increasing the amount of copper attached to the pins of the ADP124/ADP125. However, as shown in Table 6, a point of diminishing returns eventually is reached, beyond which an increase in the copper size does not yield significant heat dissipation benefits. The input capacitor should be placed as close as possible to the VIN and GND pins, and the output capacitor should be placed as close as possible to the VOUT and GND pins. Use of 0402 or 0603 size capacitors and resistors achieves the smallest possible footprint solution on boards where the area is limited. Figure 41. Example ADP124 PCB Layout Figure 42. Example ADP125 PCB Layout |
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