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SE97TP Fiches technique(PDF) 49 Page - NXP Semiconductors |
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SE97TP Fiches technique(HTML) 49 Page - NXP Semiconductors |
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49 / 55 page ![]() SE97_7 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 07 — 29 January 2010 49 of 55 NXP Semiconductors SE97 DDR memory module temp sensor with integrated SPD, 3.3 V Fig 45. Package outline SOT1069-2 (HWSON8) References Outline version European projection Issue date IEC JEDEC JEITA SOT1069-2 - - - MO-229 - - - sot1069-2_po 09-10-22 09-11-18 Unit mm max nom min 0.80 0.75 0.70 0.05 0.02 0.00 2.1 2.0 1.9 1.6 1.5 1.4 3.1 3.0 2.9 0.5 1.5 0.45 0.40 0.35 0.05 A(1) Dimensions Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. HWSON8: plastic thermal enhanced very very thin small outline package; no leads; 8 terminals; body 2 x 3 x 0.8 mm SOT1069-2 A1 0.65 0.55 0.45 A2 0.2 A3 b 0.30 0.25 0.18 D(1) D2 E(1) E2 1.6 1.5 1.4 ee1 K 0.40 0.35 0.30 Lv 0.1 w 0.05 y 0.05 y1 0 1 2 mm scale X C y C y1 terminal 1 index area B A D E detail X A A3 A1 A2 terminal 1 index area b e1 e A C B v C w E2 L K D2 1 4 5 8 |
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