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PCF8883T Fiches technique(PDF) 21 Page - NXP Semiconductors |
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PCF8883T Fiches technique(HTML) 21 Page - NXP Semiconductors |
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21 / 24 page ![]() PCF8883_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 16 October 2009 21 of 24 NXP Semiconductors PCF8883 Capacitive proximity switch with auto-calibration For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 16. Abbreviations MSL: Moisture Sensitivity Level Fig 18. Temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = MSL limit, damage level peak temperature Table 9. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor HBM Human Body Model IC Integrated Circuit MM Machine Model MOS Metal Oxide Semiconductor MOSFET Metal–Oxide–Semiconductor Field-Effect Transistor MSL Moisture Sensitivity Level PCB Printed-Circuit Board RC Resistance-Capacitance RF Radio Frequency SMD Surface Mount Device |
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