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AL160815NJL Fiches technique(PDF) 5 Page - ABC Taiwan Electronics Corp |
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AL160815NJL Fiches technique(HTML) 5 Page - ABC Taiwan Electronics Corp |
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5 / 5 page ![]() AL1608□□□□L□-□□□ SPECIFICATION FOR APPROVAL Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent AR-001A Resistance test High temp. Humidity Test ( Temp. cycle ) Thermal shock test Applied current : Per spec. Time : 96 hours Temperature : 125±5℃ not change more Electrical oharacteristics shall than ±20% Total : 50 cycles Time : 1000 hours Humidity : 90±5% Temperature : 40±2℃ Room temp. 15 minutes 15 minutes Room temp. REF : 20080424-A PROD. NAME Ⅷ﹒RELIABILITY TEST: Solderability THIN FILM CHIP INDUCTOR Specification terminal electrode Shall be covered More than 95% of the With fresh solder. Test item Test condition Flux : Rosin Dip time : 5±0.5 seconds Solder temp. : 235±5℃ Preheat : 155 / 4 hours. ℃ ABC'S DWG No. ABC'S ITEM No. 30 minutes +125 ℃ 30 minutes -55 ℃ PAGE: 5 |
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