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ST8024S Fiches technique(PDF) 25 Page - Sitronix Technology Co., Ltd. |
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ST8024S Fiches technique(HTML) 25 Page - Sitronix Technology Co., Ltd. |
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25 / 27 page ![]() ST8024S Ver 0.39 Page 25/27 2008/05/05 273 Y223 -3430.70 350.00 286 Y236 -3859.70 350.00 274 Y224 -3463.70 350.00 287 Y237 -3892.70 350.00 275 Y225 -3496.70 350.00 288 Y238 -3925.70 350.00 276 Y226 -3529.70 350.00 289 Y239 -3958.70 350.00 277 Y227 -3562.70 350.00 290 Y240 -3991.70 350.00 278 Y228 -3595.70 350.00 291 DUMMY -4024.70 350.00 279 Y229 -3628.70 350.00 292 DUMMY -4057.70 350.00 280 Y230 -3661.70 350.00 293 DUMMY -4090.70 350.00 281 Y231 -3694.70 350.00 294 DUMMY -4123.70 350.00 282 Y232 -3727.70 350.00 295 V0L -4192.50 350.00 283 Y233 -3760.70 350.00 12.1 Gold Bump Size Pad No. X Y Area (um 2) 1, 43 112.00 18.00 2016.0000 2, 3, 4, 5, 39, 40, 41, 42 112.00 51.00 5712.0000 44, 295 87.00 122.00 10614.0000 6, 38 87.00 112.00 9744.0000 7, 37 99.00 42.40 4197.6000 8, 9, 35, 36 81.30 42.40 3447.1200 10 84.10 42.90 3620.7600 11 80.70 42.40 3421.6800 12, 13, 15~20, 25~28, 30~34 88.70 42.40 3760.8800 14, 29 100.20 42.40 4248.4800 21 43.30 44.40 1922.5200 22 52.85 37.85 2000.3725 23, 24 34.65 57.75 2001.0375 45~294 18.00 122.00 2196.0000 Wafer thickness = 480±20um, Bump pad height = 15um, strength=30g |
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