MPXV6115VC6U datasheet(4/8 Pages) FREESCALE

4 / 8 page

MPXV6115V

Sensors

Freescale Semiconductor

Pressure

On-chip Temperature Compensation and Calibration

Figure 2 illustrates the absolute sensing chip in the basic

Super Small Outline chip carrier (Case 482A).

Figure 3 shows a typical application circuit (output source

current operation).

Figure 4 shows the sensor output signal relative to

pressure input. Typical minimum and maximum output

curves are shown for operation over 0

° to 85°C temperature

range. The output will saturate outside of the rated pressure

range.

A fluorosilicone gel isolates the die surface and wire bonds

from the environment, while allowing the pressure signal to

be transmitted to the silicon diaphragm. The MPXV6115V

series pressure sensor operating characteristics, internal

reliability and qualification tests are based on use of dry air as

the pressure media. Media other than dry air may have

adverse effects on sensor performance and long-term

reliability. Contact the factory for information regarding media

compatibility in your application.

Figure 2. Cross Sectional Diagram SSOP (not to scale)

Figure 3. Typical Application Circuit

(Output Source Current Operation)

Figure 4. Output vs. Absolute Pressure

Fluorosilicone

Gel Die Coat

Wire

Bond

Differential Sensing

Element

Thermoplastic

Case

Stainless

Steel Cap

Lead

Frame

Die Bond

Die

VS Pin 2

+5.0 V

GND Pin 3

Vout Pin 4

MPXV6115V

to ADC

100 nF

51 K

47 pF

Transfer Function:

Vout = VS*[(0.007652*P) + 0.92] ± (Pressure error)

Vout vs. Vacuum

Transfer Function MPXV6115VC6U

4.5

3.5

2.5

1.5

0.5

*Temp Factor*0.007652*VS)

VS = 5.0 V ± 0.25 Vdc

TEMP = 0-85° C

-115

-95

-75

-55

-35

-15

Min

Max

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