| Moteur de recherche de fiches techniques de composants électroniques |
|
33984B Fiches technique(PDF) 31 Page - Freescale Semiconductor, Inc |
|
|
|||||||||||||||||||||||||||||
33984B Fiches technique(HTML) 31 Page - Freescale Semiconductor, Inc |
|
31 / 38 page ![]() Analog Integrated Circuit Device Data Freescale Semiconductor 31 33984 PACKAGING SOLDERING INFORMATION PACKAGING SOLDERING INFORMATION SOLDERING INFORMATION The 33984 is packaged in a surface mount power package intended to be soldered directly on the printed circuit board. The 33984 was qualified in accordance with JEDEC standards JESD22-A113-B and J-STD-020A. The recommended reflow conditions are as follows: • Convection: 225°C +5.0/-0°C • Vapor Phase Reflow (VPR): 215°C to 219°C • Infrared (IR)/Convection: 225°C +5.0/-0°C The maximum peak temperature during the soldering process should not exceed 230°C. The time at maximum temperature should range from 10 to 40 s maximum. |
|
Lien URL |
| ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Lien vers la fiche technique | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |