APT75DF170HJ datasheet(2/3 Pages) MICROSEMI

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APT75DF170HJ

www.microsemi.com

2- 3

All ratings @ Tj = 25°C unless otherwise specified

Electrical Characteristics

Symbol

Characteristic

Test Conditions

Min

Typ

Max

Unit

Tj = 25°C

1.8

2.2

Diode Forward Voltage

IF = 75A

Tj = 125°C

1.9

Tj = 25°C

250

IRM

Maximum Reverse Leakage Current

VR = 1700V

Tj = 125°C

500

µA

Dynamic Characteristics

Symbol

Characteristic

Test Conditions

Min

Typ

Max

Unit

Tj = 25°C

385

trr

Reverse Recovery Time

Tj = 125°C

490

Tj = 25°C

Qrr

Reverse Recovery Charge

Tj = 125°C

µC

Tj = 25°C

Err

Reverse Recovery Energy

IF = 75A

VR = 900V

di/dt = 800A/µs

Tj = 125°C

Thermal and package characteristics

Symbol

Characteristic

Min

Typ

Max

Unit

RthJC

Junction to Case Thermal resistance

0.5

RthJA

Junction to Ambient

°C/W

VISOL

RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz

2500

TJ,TSTG

Storage Temperature Range

-55

150

Max Lead Temp for Soldering:0.063” from case for 10 sec

300

°C

Torque

Mounting torque (Mounting = 8-32 or 4mm Machine and terminals = 4mm Machine)

1.5

N.m

Package Weight

29.2

SOT-227 (ISOTOP

®) Package Outline

31.5 (1.240)

31.7 (1.248)

Dimensions in Millimeters and (Inches)

7.8 (.307)

8.2 (.322)

30.1 (1.185)

30.3 (1.193)

38.0 (1.496)

38.2 (1.504)

14.9 (.587)

15.1 (.594)

11.8 (.463)

12.2 (.480)

8.9 (.350)

9.6 (.378)

Hex Nut M4

(4 places)

0.75 (.030)

0.85 (.033)

12.6 (.496)

12.8 (.504)

25.2 (0.992)

25.4 (1.000)

1.95 (.077)

2.14 (.084)

r = 4.0 (.157)

(2 places)

4.0 (.157)

4.2 (.165)

(2 places)

W=4.1 (.161)

W=4.3 (.169)

H=4.8 (.187)

H=4.9 (.193)

(4 places)

3.3 (.129)

3.6 (.143)

3.30 (.130)

4.57 (.180)

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