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MAS6116 Fiches technique(PDF) 16 Page - Micro Analog systems |
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MAS6116 Fiches technique(HTML) 16 Page - Micro Analog systems |
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16 / 18 page ![]() 16 (18) DA6116.001 27 February, 2009 SO-16 PACKAGE OUTLINE All dimensions are in accordance with JEDEC standard MS-013. SOLDERING INFORMATION N For Lead-Free / Green QFN 4mm x 5mm Resistance to Soldering Heat According to RSH test IEC 68-2-58/20 Maximum Temperature 260°C Maximum Number of Reflow Cycles 3 Reflow profile Thermal profile parameters stated in IPC/JEDEC J-STD-020 should not be exceeded. http://www.jedec.org Lead Finish Solder plate 7.62 - 25.4 µm, material Matte Tin PLANE SEATING 5°TYP. 10.50 10.10 PIN 1 1.27 TYP. 0.36 0.48 5°TYP 0.33 x 45° 0.86 TYP . 16 LEAD SO OUTLINE (300 MIL BODY) 0-0.13 RAD. 5°TYP. 5°TYP. 5°TYP. 0.25 RAD. MIN. ALL MEASUREMENTS IN mm |
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