ADP3629ARZ-R7 datasheet(6/16 Pages) AD

6 / 16 page

ADP3629/ADP3630/ADP3631

Rev. 0 | Page 6 of 16

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VDD

−0.3 V to +20 V

OUTA, OUTB

−0.3 V to VDD + 0.3 V

<200 ns

−2 V to VDD + 0.3 V

INA, INA, INB, INB, SD

−0.3 V to VDD + 0.3 V

ESD

Human Body Model (HBM)

3.5 kV

Field Induced Charged Device

Model (FICDM)

SOIC_N

1.5 kV

MSOP

1.0 kV

Junction Temperature Range

−40°C to +150°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature

Soldering (10 sec)

300°C

Vapor Phase (60 sec)

215°C

Infrared (15 sec)

260°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for a device soldered in a 4-layer circuit board

and is measured per JEDEC standards JESD51-2, JESD51-5,

and JESD51-7.

Table 3. Thermal Resistance

Package Type

θJA

Unit

8-Lead SOIC_N

110.6

°C/W

8-Lead MSOP

162.2

°C/W

ESD CAUTION

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