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ADL5356ACPZ-R2 Fiches technique(PDF) 23 Page - Analog Devices |
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ADL5356ACPZ-R2 Fiches technique(HTML) 23 Page - Analog Devices |
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23 / 24 page ![]() ADL5356 Rev. 0 | Page 23 of 24 OUTLINE DIMENSIONS COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-1 1 36 9 10 28 27 19 18 3.85 3.70 SQ 3.55 TOP VIEW 6.00 BSC SQ 5.75 BSC SQ COPLANARITY 0.08 4.00 REF 0.75 0.60 0.50 0.50 BSC PIN 1 INDICATOR 0.60 MAX 0.60 MAX 0.20 MIN EXPOSED PAD (BOTTOM VIEW) PIN 1 INDICATOR 0.35 0.28 0.23 0.20 REF 12° MAX 0.80 MAX 0.65 TYP 1.00 0.85 0.80 0.05 MAX 0.02 NOM SEATING PLANE FORPROPERCONNECTIONOF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. Figure 57. 36-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 6mm × 6 mm Body, Very Thin Quad (CP-36-1) Dimensions shown in millimeters ORDERING GUIDE Model Temperature Range Package Description Package Option ADL5356ACPZ-R21 −40°C to +85°C 36-Lead LFCSP_VQ CP-36-1 ADL5356ACPZ-R71 −40°C to +85°C 36-Lead LFCSP_VQ CP-36-1 ADL5356-EVALZ1 Evaluation Board 1 Z = RoHS Compliant Part. |
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