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MCP6051 Fiches technique(PDF) 21 Page - Microchip Technology |
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MCP6051 Fiches technique(HTML) 21 Page - Microchip Technology |
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21 / 34 page ![]() © 2009 Microchip Technology Inc. DS22182A-page 21 MCP6051/2/4 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 8-Lead SOIC (150 mil) (MCP6051, MCP6052) Example: XXXXXXXX XXXXYYWW NNN MCP6051E SN^^0919 256 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 3 e Example: AHA 919 25 8-Lead 2x3 TDFN (MCP6051, MCP6052) XXX YWW NN 14-Lead TSSOP ( MCP6054) Example: 14-Lead SOIC (150 mil) ( MCP6054) Example: XXXXXXXXXXX YYWWNNN XXXXXXXX YYWW NNN MCP6054E 0919 256 XXXXXXXXXXX MCP6054 0919256 E/SL^^ 3 e |
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