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LP2203 Fiches technique(PDF) 7 Page - Lowpower Semiconductor inc |
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LP2203 Fiches technique(HTML) 7 Page - Lowpower Semiconductor inc |
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7 / 8 page ![]() Preliminary Datasheet LP2203 LP2203 – 01 Ver. 1.1 Datasheet Feb.-2008 Page 7 of 8 temperature 125°C, TA is the ambient temperature and the θJA is the junction to ambient thermal resistance. For recommended operating conditions specification of LP2203, where TJ(MAX) is the maximum junction temperature of the die (125°C) and TA is the maximum ambient temperature. The junction to ambient thermal resistance (θJA is layout dependent) for USP-6 package is 250°C/W. PD(MAX) = (125°C−25°C) / 250 = 400mW (USP-6) PD(MAX) = (125°C−25°C) / 165 = 606mW The maximum power dissipation depends on operating ambient temperature for fixed TJ(MAX) and thermal resistance θJA. |
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