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LP2201 Fiches technique(PDF) 7 Page - Lowpower Semiconductor inc |
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LP2201 Fiches technique(HTML) 7 Page - Lowpower Semiconductor inc |
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7 / 8 page ![]() Preliminary Datasheet LP2201 LP2201 – Ver. 1.2Datasheet Jul.-2008 Page 7 of 8 temperature 125°C, TA is the ambient temperature and the θJA is the junction to ambient thermal resistance. For recommended operating conditions specification of LP2201, where TJ(MAX) is the maximum junction temperature of the die (125°C) and TA is the maximum ambient temperature. The junction to ambient thermal resistance (θJA is layout dependent) for SOT23-6 package is 250°C/W. PD(MAX) = (125°C−25°C) / 250 = 400mW (SOT23-6) PD(MAX) = (125°C−25°C) / 165 = 606mW The maximum power dissipation depends on operating ambient temperature for fixed TJ(MAX) and thermal resistance θJA. |
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