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STM8L101F2P3ATR Fiches technique(PDF) 66 Page - STMicroelectronics |
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STM8L101F2P3ATR Fiches technique(HTML) 66 Page - STMicroelectronics |
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66 / 77 page ![]() Package characteristics STM8L101xx 66/77 Doc ID 15275 Rev 7 E 4.90 5.00 5.10 0.1929 0.1969 0.2008 E2 3.20 3.45 3.70 0.1260 0.1358 0.1457 e 0.500 0.0197 L 0.30 0.40 0.50 0.0118 0.0157 0.0197 ddd 0.08 0.0031 Number of pins N32 1. Thickness valid for the WFQFPN32 package in the sampling phase. In the production phase, the UFQFPN32 package will be used with a thickness equal to 0.6 mm. 2. Values in inches are converted from mm and rounded to 4 decimal digits. Table 39. WFQFPN32 - 32-lead very very thin fine pitch quad flat no-lead package (5 x 5), package mechanical data(1) (continued) Dim. mm inches(2) Min Typ Max Min Typ Max |
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