© 2009 Microchip Technology Inc.

DS21191R-page 23

24AA128/24LC128/24FC128

8-Lead Chip Scale Package (CS) – [CSP]

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Notes:

1. Orientation reference feature may vary, but must be located within the hatched area.

2. Package is saw singulated.

3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

4. Package size varies with specific devices. Please contact your local Microchip representative for specific details.

Microchip Technology Drawing C04-6001A Sheet 2 of 2