ADP2114ACPZ-R7 datasheet(37/40 Pages) AD

37 / 40 page

ADP2114

Rev. 0 | Page 37 of 40

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2

0.30

0.23

0.18

0.20 REF

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

12° MAX

1.00

0.85

0.80

SEATING

PLANE

COPLANARITY

0.08

0.50

0.40

0.30

3.50 REF

0.50

BSC

PIN 1

INDICATOR

TOP

VIEW

5.00

BSC SQ

4.75

BSC SQ

3.25

3.10 SQ

2.95

PIN 1

INDICATOR

0.60 MAX

0.25 MIN

EXPOSED

PAD

(BOTTOM VIEW)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 85. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

5 mm × 5 mm Body, Very Thin Quad

(CP-32-2)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range1

Package Description

Package Option

Ordering Quantity

ADP2114ACPZ-R72

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-32-2

1,500

ADP2114-2PH-EVALZ2

Single output, dual-phase interleaved, 1.2 V at 4 A,

1.2 MHz switching frequency, forced PWM

ADP2114-EVALZ2

Dual output, 3.3 V at 2 A and 1.8 V at 2 A, 600 kHz

switching frequency, pulse skip enabled

1 Operating junction temperature is −40°C to +125°C.

2 Z = RoHS Compliant Part.

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