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ADP1877ACPZ-R7 Fiches technique(PDF) 31 Page - Analog Devices |
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ADP1877ACPZ-R7 Fiches technique(HTML) 31 Page - Analog Devices |
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31 / 32 page ![]() ADP1877 Rev. 0 | Page 31 of 32 OUTLINE DIMENSIONS COMPLIANT TO JEDEC STANDARDS MO-220-WHHD. 1 0.50 BSC BOTTOM VIEW TOP VIEW PIN 1 INDICATOR 32 9 16 17 24 25 8 EXPOSED PAD PIN 1 INDICATOR 3.65 3.50 SQ 3.45 SEATING PLANE 0.05 MAX 0.02 NOM 0.20 REF COPLANARITY 0.08 0.30 0.25 0.18 5.10 5.00 SQ 4.90 0.80 0.75 0.70 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 0.50 0.40 0.30 0.25 MIN Figure 45. 32-Lead Lead Frame Chip Scale Package [LFCSP] 5 mm × 5 mm Body, Very Thin Quad (CP-32-11) Dimensions shown in millimeters ORDERING GUIDE Model Temperature Range Package Description Package Option ADP1877ACPZ-R71 −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP] CP-32-11 ADP1877HC-EVALZ1 Evaluation Board with 13 A Output 1 Z = RoHS Compliant Part. |
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