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AD8235 Fiches technique(PDF) 20 Page - Analog Devices |
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AD8235 Fiches technique(HTML) 20 Page - Analog Devices |
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20 / 20 page ![]() AD8235 Rev. 0 | Page 20 of 20 OUTLINE DIMENSIONS A B C D 0.657 0.602 0.546 1.61 1.57 1.53 2.08 2.04 2.00 1 2 3 BOTTOM VIEW (BALL SIDE UP) TOP VIEW (BALL SIDE DOWN) 0.330 0.310 0.290 1.50 REF SEATING PLANE 1.00 REF 0.50 REF 0.355 0.330 0.304 0.020 REF 0.280 0.250 0.220 0.230 0.212 0.192 0.348 0.328 0.308 0.04 MAX COPLANARITY BALL A1 IDENTIFIER Figure 45. 11-Ball, Backside-Coated, Wafer Level Chip Scale Package [WLCSP] (CB-11-1) Dimensions shown in millimeters ORDERING GUIDE Model Temperature Range Package Description Package Option Branding AD8235ACBZ-P71 −40°C to + 125°C 11-Ball [WLCSP] CB-11-1 H20 1 Z = RoHS Compliant Part. ©2009 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D08211-0-8/09(0) |
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