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SE97TP Fiches technique(PDF) 45 Page - NXP Semiconductors |
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SE97TP Fiches technique(HTML) 45 Page - NXP Semiconductors |
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45 / 54 page ![]() SE97_5 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 05 — 6 August 2009 45 of 54 NXP Semiconductors SE97 DDR memory module temp sensor with integrated SPD, 3.3 V Fig 41. Package outline SOT908-1 (HVSON8) 0.5 0.2 1 0.05 0.00 A1 Eh b UNIT D(1) y e 1.5 e1 REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 3.1 2.9 cDh 1.65 1.35 y1 3.1 2.9 2.25 1.95 0.3 0.2 0.05 0.1 DIMENSIONS (mm are the original dimensions) SOT908-1 MO-229 E(1) 0.5 0.3 L 0.1 v 0.05 w SOT908-1 HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 x 3 x 0.85 mm A(1) max. 05-09-26 05-10-05 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. X terminal 1 index area B A D E detail X A A1 c C y C y1 exposed tie bar (4 ×) exposed tie bar (4 ×) b terminal 1 index area e1 e A C B v M C w M Eh Dh L 14 5 8 0 1 2 mm scale |
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