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ASM2P2310A Fiches technique(PDF) 6 Page - PulseCore Semiconductor |
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ASM2P2310A Fiches technique(HTML) 6 Page - PulseCore Semiconductor |
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6 / 11 page ![]() November 2006 ASM2P2310A rev 0.3 2.5-V TO 3.3-V High-Performance Clock Buffer 6 of 11 Notice: The information in this document is subject to change without notice. Timing Requirements Over recommended ranges of supply voltage and operating free-air temperature Symbol Parameter Test Conditions Min Typ Max Unit VDD = 3 V to 3.6V 0 200 fclk Clock frequency VDD = 2.3 V to 2.7V 0 170 MHz Switching Characteristics Over recommended operating free-air temperature range (unless otherwise noted) VDD = 3.3 V ±0.3 V (See Figure 2) Symbol Parameter Test Conditions Min Typ Max Unit tPLH tPHL CLK to Yn f = 0 MHz to 200 MHz For circuit load, see Figure 2. 1.3 2.8 nS tsk(o) Output skew (Ym to Yn) 1(see Figure 4) 100 pS tsk(p) Pulse skew (see Figure 5) 250 pS tsk(pp) Part-to-part skew 500 pS tr Rise time (see Figure 3) VO = 0.4V to 2V 0.7 2 V/nS tf Fall time (see Figure 3) VO = 2 V to 0.4V 0.7 2 V/nS tsu(en) Enable setup time,G_high before CLK↓ 0.1 nS tsu(dis) Disable setup time, G_low before CLK↓ 0.1 nS th(en) Enable hold time, G_high after CLK ↓ 0.4 nS th(dis) Disable hold time, G_low after CLK ↓ 0.4 nS Note: 1 The tsk(o) specification is only valid for equal loading of all outputs VDD = 2.5 V ±0.2 V (See Figure 2) Symbol Parameter Test Conditions Min Typ Max Unit tPLH tPHL CLK to Yn f = 0MHz to 170MHz For circuit load, see Figure 2. 1.5 3.5 nS tsk(o) Output skew (Ym to Yn) 1(see Figure 4) 170 pS tsk(p) Pulse skew (see Figure 5) 400 pS tsk(pp) Part-to-part skew 600 pS tr Rise time (see Figure 3) VO = 0.4V to 1.7V 0.5 1.4 V/nS tf Fall time (see Figure 3) VO = 1.7V to 0.4V 0.5 1.4 V/nS tsu(en Enable setup time,G_high before CLK↓ 0.1 nS tsu(dis) Disable setup time, G_low before CLK↓ 0.1 nS th(en) Enable hold time, G_high after CLK ↓ 0.4 nS th(dis) Disable hold time, G_low after CLK ↓ 0.4 nS Note: 1 The tsk(o) specification is only valid for equal loading of all outputs. |
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