TNETE2201B

1.25-GIGABIT ETHERNET TRANSCEIVER

SLLS367A – JUNE 1999 – REVISED AUGUST 1999

18

POST OFFICE BOX 655303

MECHANICAL INFORMATION

PJD (S-PQFP-G64)

PowerPAD

™ PLASTIC QUAD FLATPACK (DIE DOWN)

Thermal Pad

(See Note D)

0,13 NOM

0,25

0,45

0,75

Seating Plane

4147703/A 12/97

Gage Plane

0,17

0,27

33

16

48

1

7,50 TYP

49

64

SQ

9,80

1,05

0,95

11,80

12,20

1,20 MAX

10,20

SQ

17

32

0,08

0,50

M

0,08

0

°–7°

0,15

0,05

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions include mold flash or protrusions.

D. The package thermal performance may be enhanced by attaching an external heat sink to the thermal pad. This pad is electrically

and thermally connected to the backside of the die and possibly selected leads.

E. Falls within JEDEC MS-026

PowerPAD is a trademark of Texas Instruments Incorporated.