THS4031 datasheet(35/38 Pages) TI

No de pièce	THS4031

Description	100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS

PDF	38 Pages

Scroll/Zoom	100%

Fabricant	TI [Texas Instruments]

Site Internet	http://www.ti.com

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35 / 38 page

THS4031, THS4032

100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS

SLOS224C – JULY 1999 – REVISED APRIL 2000

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

MECHANICAL INFORMATION

DGN (S-PDSO-G8)

PowerPAD

™ PLASTIC SMALL-OUTLINE PACKAGE

0,69

0,41

0,25

Thermal Pad

(See Note D)

0,15 NOM

Gage Plane

4073271/A 04/98

4,98

0,25

3,05

4,78

2,95

3,05

2,95

0,38

0,15

0,05

1,07 MAX

Seating Plane

0,10

0,65

0,25

°–6°

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions include mold flash or protrusions.

D. The package thermal performance may be enhanced by attaching an external heat sink to the thermal pad.

This pad is electrically and thermally connected to the backside of the die and possibly selected leads.

E. Falls within JEDEC MO-187

PowerPAD is a trademark of Texas Instruments.

THS4031 Fiches technique(PDF) 35 Page - Texas Instruments