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ZADCS147 Fiches technique(PDF) 18 Page - Zentrum Mikroelektronik Dresden AG |
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ZADCS147 Fiches technique(HTML) 18 Page - Zentrum Mikroelektronik Dresden AG |
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18 / 19 page ![]() Datasheet ZADCS146 / ZADCS147 Copyright © 2008, ZMD AG, Rev. 1.1 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice. 18/19 4 Package Drawing The IC is packaged in a 20 pin SSOP-package that has the dimensions as shown in Figure 18 and Table 7. Table 7: Package Dimensions (mm) Symbol A A1 A2 bP c D E enom HE LP Z k Q Nominal 1.86 0.13 1.73 0.30 0.15 7.20 5.30 7.80 4° Maximum 1.99 0.21 1.78 0.38 0.20 7.33 5.38 7.90 0.74 8° Minimum 1.73 0.05 1.68 0.25 0.09 7.07 5.20 0.65 7.65 0.63 0.25 0° Figure 18: Package Outline Dimensions |
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