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LM75BDP Fiches technique(PDF) 22 Page - NXP Semiconductors |
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LM75BDP Fiches technique(HTML) 22 Page - NXP Semiconductors |
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22 / 29 page ![]() LM75B_2 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 02 — 9 December 2008 22 of 29 NXP Semiconductors LM75B Digital temperature sensor and thermal watchdog Fig 21. Package outline SOT505-1 (TSSOP8) UNIT A1 A max. A2 A3 bp L HE Lp wy v ce D(1) E(2) Z(1) θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.45 0.25 0.28 0.15 3.1 2.9 3.1 2.9 0.65 5.1 4.7 0.70 0.35 6 ° 0 ° 0.1 0.1 0.1 0.94 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.7 0.4 SOT505-1 99-04-09 03-02-18 w M bp D Z e 0.25 14 8 5 θ A A2 A1 Lp (A3) detail X L HE E c v M A X A y 2.5 5 mm 0 scale TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1 1.1 pin 1 index |
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