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MBRF1090 Fiches technique(PDF) 4 Page - Vishay Siliconix |
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MBRF1090 Fiches technique(HTML) 4 Page - Vishay Siliconix |
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4 / 5 page ![]() New Product MBR(F,B)1090 & MBR(F,B)10100 Vishay General Semiconductor Document Number: 89034 Revision: 19-May-08 For technical questions within your region, please contact one of the following: PDD-Americas@vishay.com, PDD-Asia@vishay.com, PDD-Europe@vishay.com www.vishay.com 479 PACKAGE OUTLINE DIMENSIONS in inches (millimeters) 0.154 (3.91) 0.148 (3.74) DIA. 0.113 (2.87) 0.103 (2.62) 0.185 (4.70) 0.175 (4.44) 0.055 (1.39) 0.045 (1.14) 0.145 (3.68) 0.135 (3.43) 0.350 (8.89) 0.330 (8.38) 0.160 (4.06) 0.140 (3.56) 0.037 (0.94) 0.027(0.68) 0.205 (5.20) 0.195 (4.95) 0.560 (14.22) 0.530 (13.46) 0.022 (0.56) 0.014 (0.36) 0.110 (2.79) 0.100 (2.54) 12 1.148 (29.16) 1.118 (28.40) 0.105 (2.67) 0.095 (2.41) 0.635 (16.13) 0.625 (15.87) 0.603 (15.32) 0.573 (14.55) PIN 0.415 (10.54) MAX. 0.370 (9.40) 0.360 (9.14) 0.057 (1.45) 0.045 (1.14) CASE PIN 2 PIN 1 TO-220AC ITO-220AC PIN 1 2 0.025 (0.64) 0.015 (0.38) 0.404 (10.26) 0.384 (9.75) 0.076 (1.93) REF. 0.076 (1.93) REF. 45° REF. 0.600 (15.24) 0.580 (14.73) 0.560 (14.22) 0.530 (13.46) 0.035 (0.89) 0.025 (0.64) 0.205 (5.21) 0.195 (4.95) 0.191 (4.85) 0.171 (4.35) 0.057 (1.45) 0.045 (1.14) 0.671 (17.04) 0.651 (16.54) 0.028 (0.71) 0.020 (0.51) 0.110 (2.79) 0.100 (2.54) 7° REF. 7° REF. 7° REF. 0.350 (8.89) 0.330 (8.38) 0.140 (3.56) DIA. 0.125 (3.17) DIA. 0.135 (3.43) DIA. 0.122 (3.08) DIA. 0.110 (2.79) 0.100 (2.54) 0.190 (4.83) 0.170 (4.32) 0.380 (9.65) 0.41 1 (10.45) 0.320 (8.13) 0.360 (9.14) 0.591(15.00) 0.624 (15.85) 1 2 0.245 (6.22) MIN K K 0.160 (4.06) 0.190 (4.83) 0.045 (1.14) 0.055 (1.40) 0.014 (0.36) 0.021 (0.53) 0.110 (2.79) 0.140 (3.56) 0.110 (2.79) 0.090 (2.29) 0.047 (1.19) 0.055 (1.40) 0 to 0.01 (0 to 0.254) 0.027 (0.686) 0.037 (0.940) 0.105 (2.67) 0.095 (2.41) 0.205 (5.20) 0.195 (4.95) TO-263AB 0.105 (2.67) 0.08 (0.095) (2.41) (2.032) 0.42 (10.66) 0.670 (17.02) 0.591 (15.00) 0.15 (3.81) 0.33 (8.38) Mounting Pad Layout MIN. MIN. MIN. MIN. |
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