New Product

SS8P2CL & SS8P3CL

Vishay General Semiconductor

www.vishay.com

For technical questions within your region, please contact one of the following:

PDD-Americas@vishay.com, PDD-Asia@vishay.com, PDD-Europe@vishay.com

Document Number: 89030

Revision: 30-Jul-08

4

PACKAGE OUTLINE DIMENSIONS in inches (millimeters)

Conform to JEDEC TO-277A

0.016 (0.40)

0.006 (0.15)

0.047 (1.20)

0.039 (1.00)

0.187 (4.75)

0.175 (4.45)

0.262 (6.65)

0.250 (6.35)

0.242 (6.15)

0.238 (6.05)

0.171 (4.35)

0.167 (4.25)

K

21

0.026 (0.65) NOM.

TO-277A (SMPC)

0.146 (3.70)

0.134 (3.40)

0.087 (2.20)

0.075 (1.90)

0.189 (4.80)

0.173 (4.40)

0.049 (1.24)

0.037 (0.94)

0.053 (1.35)

0.041 (1.05)

0.030 (0.75) NOM.

0.084 (2.13) NOM.

0.155 (3.94)

NOM.

Mounting Pad Layout

0.268

(6.80)

0.186

(4.72)

MIN.

0.050

(1.27)

MIN.

0.041

(1.04)

0.055

(1.40)

MIN.

0.189

(4.80)

MIN.