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TDA2009 Fiches technique(PDF) 10 Page - STMicroelectronics |
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TDA2009 Fiches technique(HTML) 10 Page - STMicroelectronics |
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10 / 12 page ![]() The power dissipated in the circuit must be re- moved by adding an external heatsink. Thanks to the MULTIWATT ® package attaching the heatsink is very simple, a screw or a compres- sion spring (clip) being sufficient. Between the heatsinkand the package it is better to insert a layer of silicon grease, to optimize the thermal contact ; no electrical isolation is needed between the two MOUNTING INSTRUCTIONS Figure 18 : Maximum Allowable Power Dissipa- tion versus Ambient Temperature Figure 19 : Output Power versus Case Temperature Figure 20 : Output Power and Drain Current ver- sus Case Temperature TDA2009A 10/12 |
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