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MPX5100AP Fiches technique(PDF) 8 Page - Freescale Semiconductor, Inc

No de pièce MPX5100AP
Description  Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
PDF  16 Pages
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Fabricant  FREESCALE [Freescale Semiconductor, Inc]
Site Internet  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPX5100AP Fiches technique(HTML) 8 Page - Freescale Semiconductor, Inc

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MPX5100
Sensors
8
Freescale Semiconductor
PACKAGE DIMENSIONS
PIN 1
F
G
N
L
R
12
34
5
6
6 PL
D
SEATING
PLANE
-T-
M
A
M
0.136 (0.005)
T
POSITIVE PRESSURE
(P1)
C
B
M
J
S
-A-
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
STYLE 3:
PIN 1. OPEN
2. GROUND
3. +VOUT
4. +VSUPPLY
5. -VOUT
6. OPEN
STYLE 2:
PIN 1. OPEN
2. GROUND
3. -VOUT
4. VSUPPLY
5. +VOUT
6. OPEN
MAX
MILLIMETERS
INCHES
16.00
13.56
5.59
0.84
1.63
0.100 BSC
2.54 BSC
0.40
18.42
30˚ NOM
30˚ NOM
12.57
11.43
DIM
A
B
C
D
F
G
J
L
M
N
R
S
MIN
0.595
0.514
0.200
0.027
0.048
0.014
0.695
0.475
0.430
0.090
MAX
0.630
0.534
0.220
0.033
0.064
0.016
0.725
0.495
0.450
0.105
MIN
15.11
13.06
5.08
0.68
1.22
0.36
17.65
12.07
10.92
2.29
2.66
NOTES:
1.
2.
3.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
CASE 867-08
ISSUE N
UNIBODY PACKAGE



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