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STPS20H100CG Fiches technique(PDF) 4 Page - STMicroelectronics |
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STPS20H100CG Fiches technique(HTML) 4 Page - STMicroelectronics |
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4 / 7 page ![]() STPS20H100CT/CF/CG/CG-1 4/7 PACKAGE MECHANICAL DATA TO-220AB A C D L7 Dia L5 L6 L9 L4 F H2 G G1 L2 F2 F1 E M REF. DIMENSIONS Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 F2 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 G1 2.40 2.70 0.094 0.106 H2 10 10.40 0.393 0.409 L2 16.4 typ. 0.645 typ. L4 13 14 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M 2.6 typ. 0.102 typ. Diam. 3.75 3.85 0.147 0.151 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0.1 1.0 10.0 100.0 IFM(A) Tj=125 °C Typical values Tj=125 °C Tj=25 °C Tj=150 °C Typical values VFM(V) Fig. 9: Forward voltage drop versus forward current (maximum values, per diode). 0 5 10 15 20 25 30 35 40 0 10 20 30 40 50 60 70 80 S(Cu) (cm ) Rth(j-a) ( °C/W) Fig. 10: Thermal resistance junction to ambient versus copper surface undertab(Epoxy printedcircuit board FR4, copper thickness: 35 µm) (D2PAK). |
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