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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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L5980 Fiches technique(PDF) 33 Page - STMicroelectronics |
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L5980 Fiches technique(HTML) 33 Page - STMicroelectronics |
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33 / 37 page  Package mechanical data L5980 33/37 6 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of the second level interconnect is marked on the package and on the inner box label, in compliance with the JEDEC Standard JESD97. The maximum ratings related to soldering condition are also marked on the inner box label. ECOPACK® is an ST trademark. ECOPACK specifications are available at: www.st.com |
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