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STPS10150 Fiches technique(PDF) 4 Page - STMicroelectronics |
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STPS10150 Fiches technique(HTML) 4 Page - STMicroelectronics |
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4 / 5 page ![]() STPS10150CT/CG 4/5 PACKAGE MECHANICAL DATA TO-220AB A C D L7 Dia L5 L6 L9 L4 F H2 G G1 L2 F2 F1 E M REF. DIMENSIONS Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 F2 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 G1 2.40 2.70 0.094 0.106 H2 10 10.40 0.393 0.409 L2 16.4 typ. 0.645 typ. L4 13 14 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M 2.6 typ. 0.102 typ. Diam. 3.75 3.85 0.147 0.151 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.1 1.0 10.0 100.0 VFM(V) IFM(A) Tj=125°C Tj=25°C Tj=125°C Typical values Fig. 9: Forward voltage drop versus forward current (maximum values, per diode). 0 2 4 6 8 101214 161820 0 10 20 30 40 50 60 70 80 S(cm²) Rth(j-a) (°C/W) Fig. 10: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board, copper thickness: 35µm) (STPS10150CG only). |
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