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TSL1018 Fiches technique(PDF) 2 Page - STMicroelectronics |
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TSL1018 Fiches technique(HTML) 2 Page - STMicroelectronics |
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2 / 15 page ![]() Absolute maximum ratings and operating conditions TSL1018 2/15 1 Absolute maximum ratings and operating conditions Table 1. Absolute maximum ratings Symbol Parameter Value Unit VDD Supply voltage 18 V VIN Input voltage VSS -0.5V to VDD +0.5V V IOUT Output current (A to R buffers) Output current (COM buffer) 40 150 mA RTHJA Thermal resistance junction to ambient for TQFP48 ePad not thermally connected to PCB ePad thermally connected to PCB 85 36 °C/W PD Power dissipation(1) for TQFP48 ePad ePad not thermally connected to PCB ePad thermally connected to PCB 1. PD is calculated with Tamb = 25°C, TJ = 150°C and RTHJA . 1470 3470 mW TLEAD Lead temperature (soldering 10 seconds) 260 °C TSTG Storage temperature -65 to +150 °C TJ Junction temperature 150 °C ESD Human body model (HBM)(2) 2. Human body model: a 100pF capacitor is charged to the specified voltage, then discharged through a 1.5k Ω resistor between two pins of the device. This is done for all couples of connected pin combinations while the other pins are floating. 2000 V Machine model (MM)(3) 3. Machine model: a 200pF capacitor is charged to the specified voltage, then discharged directly between two pins of the device with no external series resistor (internal resistor < 5 Ω). This is done for all couples of connected pin combinations while the other pins are floating. 200 Charged device model (CDM) (4) 4. Charged device model: all pins and package are charged together to the specified voltage and then discharged directly to the ground through only one pin. 1500 Table 2. Operating conditions Symbol Parameter Value Unit VCC Supply voltage (VDD - VSS) 5.5 to 16.8 V Tamb Ambient temperature -40 to +95 °C VIN Input voltages for buffers A & B VSS + 1.5V to VDD V Input voltages for buffers C to R & COM VSS to VDD - 1.5V |
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