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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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STV6414A Fiches technique(PDF) 30 Page - STMicroelectronics |
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STV6414A Fiches technique(HTML) 30 Page - STMicroelectronics |
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30 / 32 page  Package mechanical data STV6414A 30/32 6.1 Lead-free packaging To meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. E3 7.50 0.295 e 0.50 0.019 L 0.45 0.60 0.75 0.017 0.023 0.029 L1 1.00 0.039 Degrees K 0° minimum 3.5° typical 7° maximum Table 27. LQFP64 package dimensions (continued) Dimension Millimeters Inches Minimum Typical Maximum Minimum Typical Maximum |
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