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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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STV6412BD Fiches technique(PDF) 30 Page - STMicroelectronics |
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STV6412BD Fiches technique(HTML) 30 Page - STMicroelectronics |
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30 / 32 page  Package mechanical data STV6412B 30/32 6.1 Environment In order to meet environmental requirements, STMicroelectronics offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. E1 13.80 14.00 14.201 0.543 0.551 0.559 E3 12.00 0.472 L 0.45 0.60 0.75 0.018 0.024 0.030 L1 1.00 0.039 Degrees k 0° minimum 3.5° typical 7° maximum Table 26. LQFP64 package dimensions (continued) |
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