ADP2504ACPZ-5.0-R71 datasheet(4/16 Pages) AD

4 / 16 page

ADP2503/ADP2504

Preliminary Technical Data

ABSOLUTE MAXIMUM RATINGS

Table 1.

Parameter

PVIN, VIN, SW1, SW2, VOUT, SYNC,

−0.3 V to +6 V

EN, FB

PGND to AGND

−0.3 V to 0.3 V

Operating Ambient Temperature

−40°C to +85°C

Operating Junction Temperature

−40°C to +125°C

Storage Temperature

−65°C to +150°C

Lead Temperature

Soldering (10 sec)

300°C

Vapor Phase (60 sec)

215°C

Infrared (15 sec)

220°C

ESD Human Body Model

±1000 V

ESD Charged Device Model

±500 V

ESD Machine Model

±100 V

Rating

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Absolute maximum ratings apply individually only, not in

combination. Unless otherwise specified, all other voltages are

referenced to GND.

THERMAL RESISTANCE

θJA is specified for device soldered JEDEC2S2P PCB. For a

typical printed circuit board of a handset, the total thermal

resistance is higher. For correct operation up to 85°C ambient

temperature the total thermal resistance must not exceed

100 K/W.

Table 2.

Package Type

Unit

10-Lead LFCSP (QFN)

°C/W

ESD CAUTION

Rev. PrB | Page 4 of 16

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