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TS2012IQT Fiches technique(PDF) 28 Page - STMicroelectronics |
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TS2012IQT Fiches technique(HTML) 28 Page - STMicroelectronics |
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28 / 30 page ![]() Package information TS2012 28/30 Figure 48. QFN20 package footprint Note: The QFN20 package has an exposed pad E2 x D2. For enhanced thermal performance, the exposed pad must be soldered to a copper area on the PCB, acting as a heatsink. This copper area can be electrically connected to pin 4, 12, 18 (PGND, AGND) or left floating. Table 10. QFN20 package mechanical data Ref Dimensions in mm Min Typ Max A0.8 0.9 1 A1 0.02 0.05 A2 0.65 1 A3 0.25 b 0.18 0.23 0.3 D 3.85 4 4.15 D2 2.6 E 3.85 4 4.15 E2 2.6 e 0.45 0.5 0.55 L0.3 0.4 0.5 ddd 0.08 A4.55 B4.55 C0.50 D0.35 E0.65 F2.45 G0.40 FOOTPRINT DATA (mm) |
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