TDA7563AH datasheet(30/35 Pages) STMICROELECTRONICS

30 / 35 page

Package information

TDA7563A

30/35

Package information

In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®

packages. ECOPACK® packages are lead-free. The category of second Level Interconnect

is marked on the package and on the inner box label, in compliance with JEDEC Standard

JESD97. The maximum ratings related to soldering conditions are also marked on the inner

box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 32.

PowerSO36 (slug up) mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

3.25

3.43

0.128

0.135

3.1

3.2

0.122

0.126

0.8

0.031

0.039

0.2

0.008

0.030

-0.040

0.0011

-0.0015

0.22

0.38

0.008

0.015

0.23

0.32

0.009

0.012

15.8

0.622

0.630

9.4

9.8

0.37

0.38

0.039

13.9

14.5

0.547

0.57

10.9

11.1

0.429

0.437

2.9

0.114

5.8

6.2

0.228

0.244

2.9

3.2

0.114

1.259

e0.65

0.026

11.05

0.435

0.075

0.003

15.5

15.9

0.61

0.625

1.1

0.043

0.8

1.1

0.031

0.043

10˚

s8 ˚8˚

(1) “D and E1” do not include mold flash or protusions.

Mold flash or protusions shall not exceed 0.15mm (0.006”)

(2) No intrusion allowed inwards the leads.

PowerSO36 (SLUG UP)

7183931 D

TDA7563AH Fiches technique(PDF) 30 Page - STMicroelectronics

TDA7563AH Fiches technique(HTML) 30 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35

Fiches technique Télécharger

Lien URL