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L6731D Fiches technique(PDF) 21 Page - STMicroelectronics |
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L6731D Fiches technique(HTML) 21 Page - STMicroelectronics |
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21 / 23 page ![]() L6731D Package mechanical data 21/23 7 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 13. HTSSOP16 mechanical data DIM. mm. inch MIN. TYP MAX. MIN. TYP. MAX. A 1.2 0.047 A1 0.15 0.004 0.006 A2 0.8 1 1.05 0.031 0.039 0.041 b 0.19 0.30 0.007 0.012 c 0.09 0.20 0.004 0.0089 D 4.9 5 5.1 0.193 0.197 0.201 D1 3.0 0.118 E 6.2 6.4 6.6 0.244 0.252 0.260 E1 4.3 4.4 4.5 0.169 0.173 0.177 E2 3.0 0.118 e 0.65 0.0256 K0° 8° 0° 8° L 0.45 0.60 0.75 0.018 0.024 0.030 TSSOP16 EXPOSED PAD MECHANICAL DATA 7419276A 2.8 3.1 1.102 1.220 2.8 3.1 1.102 1.220 |
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