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TS4990 Fiches technique(PDF) 28 Page - STMicroelectronics |
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TS4990 Fiches technique(HTML) 28 Page - STMicroelectronics |
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28 / 32 page ![]() Package information TS4990 28/32 5.3 DFN8 package information Note: DFN8 exposed pad (E2 x D2) is connected to pin number 7. For enhanced thermal performance, the exposed pad must be soldered to a copper area on the PCB, acting as a heatsink. This copper area can be electrically connected to pin7 or left floating. Figure 72. DFN8 3x3x0.90mm package mechanical drawing (pitch 0.5mm) Table 9. DFN8 3x3x0.90mm package mechanical data (pitch 0.5mm) Ref. Dimensions Millimeters Mils Min. Typ. Max. Min. Typ. Max. A 0.80 0.90 1.00 31.5 35.4 39.4 A1 0.02 0.05 0.8 2.0 A2 0.55 0.65 0.80 217 25.6 31.5 A3 0.20 7.9 b 0.18 0.25 0.30 7.1 9.8 11.8 D 2.85 3.00 3.15 112.2 118.1 124 D2 2.20 2.70 86.6 106.3 E 2.85 3.00 3.15 112.2 118.1 124 E2 1.40 1.75 55.1 68.9 e 0.50 19.7 L 0.30 0.40 0.50 11.8 15.7 19.7 ddd 0.08 3.1 |
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