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ESDA6V1SC6 Fiches technique(PDF) 8 Page - STMicroelectronics |
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ESDA6V1SC6 Fiches technique(HTML) 8 Page - STMicroelectronics |
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8 / 11 page ![]() Package information ESDAxxSCx 8/11 5 Package information ● Epoxy meets UL94, V0 standard In order to meet environmental requirements, ST (also) offers these devices in ECOPACK® packages. ECOPACK® packages are Lead-free. The category of second level Interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 13. SOT23-5L footprint (dimensions in mm) Table 4. SOT23-5L dimensions Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.90 1.45 0.035 0.057 A1 0 0.10 0 0.004 A2 0.90 1.30 0.035 0.051 b 0.35 0.50 0.014 0.020 c 0.09 0.20 0.004 0.008 D 2.80 3.05 0.11 0.118 E 1.50 1.75 0.059 0.069 e0.95 0.037 H 2.60 3.00 0.102 0.118 L 0.10 0.60 0.004 0.024 M 0° 10° 0° 10° A2 A L H c B E D e e A1 θ 0.95 0.60 1.20 1.10 3.50 2.30 |
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