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DALC208 Fiches technique(PDF) 12 Page - STMicroelectronics |
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DALC208 Fiches technique(HTML) 12 Page - STMicroelectronics |
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12 / 14 page ![]() Package information DALC208 12/14 6 Package information ● Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 27. Footprint (dimensions in mm) Table 5. SOT23-6L dimensions Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.90 1.45 0.035 0.057 A1 0 0.10 0 0.004 A2 0.90 1.30 0.035 0.051 b 0.35 0.50 0.014 0.020 c 0.09 0.20 0.004 0.008 D 2.80 3.05 0.11 0.118 E 1.50 1.75 0.059 0.069 e 0.95 0.037 H 2.60 3.00 0.102 0.118 L 0.10 0.60 0.004 0.024 θ 0° 10° 0° 10° A2 A L H c b E D e e A1 θ 0.95 0.60 1.20 1.10 3.50 2.30 |
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