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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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STTS424E02 Fiches technique(PDF) 48 Page - STMicroelectronics |
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STTS424E02 Fiches technique(HTML) 48 Page - STMicroelectronics |
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48 / 51 page  Landing pattern STTS424E02 48/51 13 Landing pattern The landing pattern recommendations per the JEDEC proposal for the TDFN package (DN) are shown in Figure 19. The preferred implementation with wide corner pads enhances device centering during assembly, but a narrower option is defined for modules with tight routing requirements. Figure 19. Landing pattern - TDFN package (DN) e/2 e/2 e2 K K E2/2 E2/2 E2 D2/2 D2 D2/2 L L e b b b2 b4 K2 K2 K2 E3 E3 e4 ai14000 |
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