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STM1061 Fiches technique(PDF) 13 Page - STMicroelectronics |
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STM1061 Fiches technique(HTML) 13 Page - STMicroelectronics |
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13 / 23 page ![]() STM1061 Maximum Rating 13/23 5 Maximum Rating Stressing the device above the rating listed in the Table 3: Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 3. Absolute Maximum Ratings Symbol Parameter Value Unit TSTG Storage Temperature (VCC Off, VBAT Off) –55 to 150 °C TSLD (1) 1. Reflow at peak temperature of 260°C (total thermal budget not to exceed 245°C for greater than 30 seconds). Lead Solder Temperature for 10 seconds 260 °C VIO Input or Output Voltage –0.3 to VCC +0.3 V VCC Supply Voltage –0.3 to 7.0 V IO Output Current 20 mA PD Power Dissipation 320 mW |
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