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USBUF01P6 Fiches technique(PDF) 2 Page - STMicroelectronics |
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USBUF01P6 Fiches technique(HTML) 2 Page - STMicroelectronics |
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2 / 9 page ![]() Characteristics USBUF01P6 2/9 1 Characteristics Table 1. Absolute maximum rating (Tamb = 25° C) Symbol Parameter Value Unit VPP ESD discharge IEC61000-4-2 air discharge IEC61000-4-2 contact discharge MIL STD 883E - Method 3015-7 ± 16 ± 9 ± 25 kV Tj Junction temperature 150 ° C Tstg Storage temperature range -55 to +150 ° C TL Maximum lead temperature for soldering during 10 s at 5 mm for case 260 ° C Top Operating temperature range -40 to + 85 ° C Table 2. Electrical characteristics (Tamb = 25° C) Symbol Parameter VRM Stand-off voltage VBR Breakdown voltage VCL Clamping voltage IRM Leakage current IPP Peak pulse current αT Voltage temperature coefficient VF Forward voltage drop Rd Dynamic resistance Symbol Test conditions Min. Typ. Max. Unit VBR IR = 1 mA 6 10 V IRM VRM = 3.3 V per line 500 nA Rt Tolerance ± 10% 33 Ω Rp Tolerance ± 10% 1.5 k Ω Ct Tolerance ± 20% 47 pF I V IF IRM IPP VRM VF VBR Slope = 1/Rd VCL |
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