STPS5L60 datasheet(6/8 Pages) STMICROELECTRONICS

6 / 8 page

Package information

STPS5L60

6/8

Package information

●

Epoxy meets UL94, V0

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at www.st.com.

Figure 16.

Footprint, dimensions in mm (inches)

Table 5.

SMC dimensions

Ref.

Dimensions

Millimeters

Inches

Min.

Max.

Min.

Max.

1.90

2.45

0.075

0.096

0.05

0.20

0.002

0.008

b(1)

Dimensions b and c apply to plated leads

2.90

3.20

0.114

0.126

c(1)

0.15

0.40

0.006

0.016

5.55

6.25

0.218

0.246

7.75

8.15

0.305

0.321

6.60

7.15

0.260

0.281

4.40

4.70

0.173

0.185

0.75

1.50

0.030

0.059

8.19

1.54

5.11

1.54

(0.061)

(0.201)

(0.322)

(0.124)

(0.061)

3.14

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