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VN808SR Fiches technique(PDF) 13 Page - STMicroelectronics |
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VN808SR Fiches technique(HTML) 13 Page - STMicroelectronics |
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13 / 17 page ![]() VN808SR Package mechanical data 13/17 7 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 10. PowerSO-36 mechanical data Dim. mm inch Min Typ Max Min Typ Max A 3.60 0.1417 a1 0.10 0.30 0.003 0.0118 a2 3.30 0.1299 a3 0 0.10 0 0.0039 b 0.22 0.38 0.008 0.0150 c 0.23 0.32 0.009 0.0126 D (1) 15.80 16.00 0.622 0.6299 D1 9.40 9.80 0.370 0.3858 E 13.90 14.50 0.547 0.5709 E1 (1) 10.90 11.10 0.429 0.4370 E2 2.90 0.1142 E3 5.8 6.2 0.228 0.2441 e 0.65 0.025 e3 11.05 0.435 G 0 0.10 0.000 0.0039 H 15.50 15.90 0.610 0.6260 h 1.10 0.0433 L 0.80 1.10 0.031 0.0433 N 10° 10° S 0° 8° 0° 8° |
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