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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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TDE1767DP Fiches technique(PDF) 13 Page - STMicroelectronics |
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TDE1767DP Fiches technique(HTML) 13 Page - STMicroelectronics |
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13 / 16 page  TDE1767 - TDE1787 Mechanical data 13/16 8 Mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. |
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