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STPS0530Z Fiches technique(PDF) 5 Page - STMicroelectronics |
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STPS0530Z Fiches technique(HTML) 5 Page - STMicroelectronics |
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5 / 7 page ![]() STPS0530Z Package information 5/7 2 Package information ● Epoxy meets UL94, V0. ● Band indicates cathode. Figure 10. Footprint (in millimeters) In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 4. SOD-123 dimensions Ref Dimensions Millimeters Inches Min. Max. Min. Max. A1.45 0.057 A1 0 0.1 0 0.004 A2 0.85 1.35 0.033 0.053 b 0.55 Typ. 0.022 Typ. c 0.15 Typ. 0.039 Typ. D 2.55 2.85 0.1 0.112 E 1.4 1.7 0.055 0.067 G 0.25 0.01 H 3.55 3.95 0.14 0.156 H b D E A1 A2 A G c 4.45 0.65 0.97 2.51 0.97 |
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