M41T81S datasheet(27/31 Pages) STMICROELECTRONICS

27 / 31 page

M41T81S

Package mechanical data

27/31

Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97.

The maximum ratings related to soldering conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 18.

SO8 – 8-lead plastic small package outline

Note:

Drawing is not to scale.

Table 14.

SO8 – 8-lead plastic small outline (150 mils body width), package

SO-A

ccc

h x 45˚

0.25 mm

GAUGE PLANE

mechanical data

Symb

inches

Typ

Min

Max

Typ

Min

Max

1.75

0.069

0.10

0.25

0.004

0.010

1.25

0.049

0.28

0.48

0.011

0.019

0.17

0.23

0.007

0.009

ccc

0.10

0.004

4.90

4.80

5.00

0.193

0.189

0.197

6.00

5.80

6.20

0.236

0.228

0.244

3.90

3.80

4.00

0.154

0.150

0.157

1.27

0.050

0.25

0.50

0.010

0.020

0°8°

0.40

0.127

0.016

0.050

1.04

0.041

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